Off-line 3D Solder Paste Inspection

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T series table top equipment provides medium, large and ultra large size platform configuration. Entire Board & Fully Automatic, High Accuracy SPC, Easy to Use

Features:

Multi-frequency PSLM: The original PSLM technology emulates the cycle of the optical grating by using software. This greatly improves the accuracy and scope of application by abolishing the mechanical drive and transmission parts. (The detection height can reach to ± 1200um) and avoids mechanical wear and maintenance costs.

Phase modulation profilemetry: Through the phase modulation of full light spectrum, providing a height resolution down to (0.37um), the number of 4-8 times sampling ensures high repeatability. Use a high-precision ball screw and linear guide rail to realize perfect detection results. 

Multi Array Mark Detection: For multi-array PCB mark, use dynamic capture function, there is no need to capture image one by one and reduce detect time dramatically.

Glue inspection: PSLM 3D measurement can reach ±1200um,with RGB Tune function is capable of high accurate measuring of none transparent glue process, including missing, overflow, excess, shape and combination view of 2D/3D images.

Bad Mark On The Fly Detection: Automatically on the fly detect PCB bad mark, feed info into pick and placement machine in real time control loop.

Multi Optional Barcode Function: Both camera barcode and external 1D/2D barcodes are supported, also provide manual key in function. 

High Resolution and High Frame Rate Image Processing Unit: Megapixel industrial CCD camera of ultra-high frame rate ensures a steady and rapid detection of very small components and high-density mounting(008004). It provides a variety of detection accuracy of 5um,7um,8um,10um,12um,15um,18um,20um etc. It meets the customer’s requirements for product diversity and detection speed.

Telecentric lens for static compensation: Sinic-Tek solves the problem of ordinary lens, squint and deformation by using a high-cost telecentric lens and special software test algorithm, which greatly enhances the inspection accuracy and inspection ability. Achieves the industry's leading static compensation for FPC warping.

2D lamp panel: 2D lamp panel avoids problems caused by the angle of the red RGB color distortion effect in solder; RGB tuning in  Different PCB colors is more versatile ; Fulfill a variety of dispensing process testing ; greatly improve the equipment ( height ,volume , area ) repeatability accuracy.

Active RGB 2D Light Source: Patented RGB Tune function takes Red, Green and Blue images and with unique filter algorism, to solve solder bridge detection false alarm and relative zero surface uncertain issue. In the meantime, provide the 2D/3D measurements and image of printed solder paste.

High Accurate Hardware Platform:   High rigid grade steel frame combines with close loop servo control and high precision level ball screw makes high speed and steady positioning. Optional linear and high precision linear encoder positioning system is capable of measuring 03015 device pad with ultra high resolution and high speed. The repeatable accuracy can go down to 1um.

Close Loop with Printer: Share real time measurement result with printer,and adjust printer parameter in time automatically.

Three Stage Mapping Traceability: Collaborate with pre and post AOI equipment in SMT line, forms close loop process and quality control system. And capable to integrate and synchronize the data to customer ERP quality modules.

5 Minutes Programming And One Press Operation: Engineers with any levels of experience can independently program the system quickly and accurately through Gerber importing software modules and the friendly programming interface.

Powerful Statistical Process Control Software: Real-time SPC information display,provides powerful quality control to the users. Complete variety of SPC tools are available for users at a glance.

MES Intelligent Manufacturing Access Capability: Sinictek develops a variety of data format ports, though the SPC system provides simple, fast, and accurate data into the clients’ MES system.

Specifications:

Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)
Inspection type Volume, area, height, XY offset, shape, etc.
Defect Types shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest component 0201
Accuracy XY=10 um,Height = 0.37 um
Repeatability height:≤1um 4 Sigma;volume/acreage<1%4 Sigma
Maximum Loading PCB Size(X*Y) 350x250mm
Inspection Speed 1.5 SEC/FOV
Fiducial Detection Time 0.3sec/piece
Maximum inspection height ±450um±1200umOption
Barcode function with traceability
Access IMS system functions
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation
SPC process control

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