CP-500 Series Automatic High Precision Paste Printer

Features:

• The PCB size is compatible with a wide range (50x50mm to 500x340mm)
• High-precision printing resolution. High positioning accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.02mm. Support glue printing.
• Fully automatic control can improve production efficiency, control quality, and save costs:
• Automatically positioning the stencil; 
• Automatic PCB correction;
• Automatic scraper pressure adjustment;
• Automatic printing
• Automatic stencil cleaning (dry cleaning, washing, vacuum cleaning mode three kinds);
• Adopt the ring printing head independently developed by Huancheng Company, programmable scraper pressure automatic adjustment system, automatically balance the scraper pressure,  precise pressure control can achieve perfect solder paste molding effect
• Programmable motor control scraper and stencil separation speed and stroke, can flexibly implement a variety of demoulding methods
• Multifunctional PCB fixed positioning system, PCB positioning is convenient, fast and accurate
• Up and down visual positioning system
• Built-in image processing system
• Support 2D, SPC function
• The printing translation is driven by the motor direct connection timing belt

Printing range of solder paste

(1), SMT process resistance, capacitance, inductance, diode, transistor and other chip components production and processing: 01005, 0201, 0402, 0603, 0805, 1206 and other specifications;

(2), IC: Support SOP, TSOP, TSSOP, QFN and other packages, minimum pitch 0.3mm;

             Support BGA, CSP package, minimum ball diameter 0.2mm;

(3), PCB size: 50mm x 50mm ~ 500mm x 340

(4), PCB thickness: 0.6mm ~ 6mm

(5), FPC thickness: below 0.6mm (with fixture)

Scope of application

Manufacturing of mobile phones, communications, LCD TVs, in-vehicle electronics, medical power equipment, aerospace and other products/equipment, and production and processing of general electronic products.

Specifications: